nichia sts - da1 - 3316 c nichia corporation specifications for white led nsswt02at - v1 pb rohs compliant
nichia sts - da1 - 3316 c 1 specifications (1) absolute maximum ratings item symbol absolute maximum rating unit forward current i f 130 ma pulse forward current i fp 150 ma reverse voltage v r 5 v power dissipation p d 442 mw operating temperature t opr - 40~100 c storage temperature t stg - 40~100 c junction temperature t j 120 c * absolute maximum ratings at t s =25c. * i fp conditions with pulse width 10ms and duty cycle 10%. (2) initial electrical/optical characteristics item symbol condition typ max unit forward voltage v f i f =65ma 3.0 - v reverse current i r v r =5v - - a r8000 luminous flux v i f =65ma 2 8 . 6 - lm chrom aticity coordinate x - i f =65ma 0.3 5 4 - - y - i f =65ma 0.3 71 - - thermal resistance r js - 40 65 c/w * characteristics at t s =25c. * luminous flux value as per cie 127:2007 standard. * chromaticity coordinates as per cie 1931 chromaticity chart. * r js is thermal resistance from junction to t s measuring point.
nichia sts - da1 - 3316 c 2 ranks item rank min max unit forward voltage v 3.0 3.2 v q 2.8 3.0 reverse current - - 50 a a 80 - - r 9 0 - - c olor ranks the color rank ha s a chromaticity range within a 3 - step macadam ellipse. rank sm503d rank sm573d rank sm653d center point x 0.354 0.33 7 0.322 y 0.371 0.3 59 0.346 minor axis a 0.003555 0.003 087 0.00 2709 major axis b 0.008418 0.00 7809 0.00 6561 ellipse rotation angle
nichia sts - da1 - 3316 c 3 rank sm655 d a rank sm655 d b rank sm655 d c rank sm655 d d rank sm655 d e rank sm655 d f center point x 0.322 y 0.346 minor axis a 0.004515 major axis b 0.010935 ellipse rotation angle s =25c. * forward voltage tolerance: 0.05v * luminous flux tolerance: 7 % * color rendering index r a tolerance: 2 * color rendering index r 9 tolerance: 6.5 * the r 9 value for the above rank shall be greater than 0. * chromatic ity coordinate tolerance: 0.00 5 * leds from the above ranks will be shipped. the rank combi nation ratio per shipment will be decided by nichia. definition of the macadam ellipse ranks: 60 a b a perfect circle is divided into 60 degree-sections and then transformed into the macadam ellipse that is presented on the chromaticity diagram in this document.
nichia sts - da1 - 3316 c 4 chromaticity diagram 0.32 0.33 0.34 0.35 0.36 0.37 0.38 0.39 0.30 0.31 0.32 0.33 0.34 0.35 0.36 0.37 x y sm575da sm655dc sm655de sm503d sm575de sm573d sm655db sm655da sm655dd sm575db sm575dc sm505db sm505dc sm505da sm505dd sm505de sm505df sm503 sm575dd sm575df sm573 sm655df 6500k 5700k 5000k chromaticity coordinate at t a =65c chromaticity coordinate at t a =25c \?E blackbody locus sm653 sm653d
nichia sts - da1 - 3316 c 5 outline dimensions ? no. ( g unit : mm) this product complies with rohs directive. u? rohs ?m??? * the dimension(s) in parentheses are for reference purposes. ????? * sts-da7-6627a nssxt02a-v1 ( g unit : mm, tolerance : 0.1) 0.75 0.15 0.55 0 . 2 8 0 . 3 8 5 ( 0 . 1 5 ) 0 . 3 8 5 ( 0 . 1 5 ) cathode encapsulating resin base anode 0.7 1 . 2 a k
nichia sts - da1 - 3316 c 6 soldering ? recommended reflow soldering condition(lead ? recommended soldering pad pattern ? recommended metal solder stencil aperture * this led is designed to be reflow soldered on to a pcb. if dip soldered or hand soldered, nichia cannot guarantee its reliability. * ref low soldering must not be performed more than twice. * avoid rapid cooling. ramp down the temperature gradually from the peak temperature. * nitrogen reflow soldering is recommended. air flow soldering conditions can cause optical degradation, caused by heat and/or atmosphere. * since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin. pressure can cause nicks, chip - outs, encapsulant delamination and deformation, and bump breaks, decreasing reliability. when using automatic pick and place machine, use a pick up nozzle which does not directly apply excess stress to the encapsulation of the leds. recommended conditions: n ozzle panasonic:# 10807gh811ag juki:#502 (picking on t he upper surface possible) * repairing should not be done after the leds have been soldered. when repairing is unavoidable, a hot plate should be used. it should be confirmed beforehand whether the characteristics of the leds will or will not be da maged by repairing. * when soldering, do not apply stress to the led while the led is hot. * when using a pick and place machine, choose an appropriate nozzle for this product. using a pick - and - place nozzle with a smaller diameter than the size of th e led's emitting surface will cause damage to the emitting surface and may also cause the led not to illuminate. * the recommended soldering pad pattern is designed for attachment of the led without problems. when precise mounting accuracy is requ ired, such as high - density mounting, ensure that the size and shape of the pad are suitable for the circuit design. * consider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder. * when flux is used, it should be a halogen free flux. ensure that the manufacturing process is not designed in a manner where the flux will come in contact with the leds. * make sure that there are no issues with the type and amount of solder that is being used. * all of the electrode pads are on the backside of this product; solder connections will not be able to be seen nor confirmed by a normal visual inspection. when using the product, ensure that there are no issues with the soldering conditions. 1 4 0 s e c 1 6 0 ~ 1 8 0 c 4 c / s e c . m a x t e m p e r a t u r e t i m e 4 c / s e c . m a x 2 6 0 c m a x 2 2 0 c 6 0 ~ 7 0 s e c ( g unit : mm ) 0.25 0 . 6 8 5 0 . 5 0 . 6 8 5 0 . 3 0 . 3 0.85 0 . 2 8 0.7 0 . 2 8 0.123 0 . 6 8 5 0 . 5 2 5 0 . 4 5 0 . 3 0 . 6 8 5 0 . 4 5 0.85 0.7 0.55 0 . 3
nichia sts - da1 - 3316 c 7 tape and reel dimensions sts-da7-7587 nxxxt02x ? no. ( g unit : mm) `? shape and dimensions of reel ?`????f ??? taping specifications (in accordance with jis standard) ?`? dimensions of tape ?`?g?? configuration of tape more than 40mm unloaded tape leading part more than 400mm g?? mounted with led `` 400mm 40mm (end) (start) `?? 4,000pcs quantity: 4,000pcs/reel O polarity progressive direction 6 0 + 1 - 0 11.4 1 9 0.3 ? label 2 1 0 . 8 1 3 0 . 5 180 + 0 - 3 2 0.5 (0.8) - 0 1.5 + 0.1 4 0.1 1 . 7 5 0 . 1 4 0.1 2 0.05 3 . 5 0 . 0 5 8 0 . 1 0.5 0.05 0.2 0.05 0.85 0.1 ( 1 . 3 3 )
nichia sts - da1 - 3316 c 8 packaging - tape & reel nichia led sts-da7-5597a nxxxxxxx ? label ? label ? no. reel ` ?` seal moisture-proof bag ?? reels are shipped in heat-sealed moisture-proof bags. `???? ?`???? moisture-proof bags are packed in cardboard boxes with corrugated partitions. ??K? ?`? ?`?????? y?????? * ? \H?y?B???y? * ?QH n???? u?p?????? * using the original package material or equivalent in transit is recommended. do not expose to water. the box is not water-resistant. do not drop or expose the box to external forces as it may damage the products. products shipped on tape and reel are packed in a moisture-proof bag. they are shipped in cardboard boxes to protect them from external forces during transportation. * u???`??? ??n?go??`y? desiccants ( possibly included) ? ??? if not provided, it will not be indicated on the label. ******* is the customer part number. O??????? * ******* ?? ? for details, see "lot numbering code" in this document. * ??????????? the label does not have the rank field for un-ranked products. * ??????????? rohs nxxxxxxx xxxx led nichia corporation 491 oka, kaminaka, anan, tokushima, japan type lot qty. ymxxxx-rrr pcs rohs nxxxxxxx xxxx led rrr pcs type rank qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan *******
nichia sts - da1 - 3316 c 9 lot numbering code lot number is presented by using the following alphanumeric code. ymxxxx - rrr y - year year y 20 14 4 2015 5 2016 6 2017 7 2018 8 2019 9 m - month month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 x 5 5 11 y 6 6 12 z xxxx - nichia's product number rrr - ranking by color coordinates, ranking by luminous flux, ranking by forward voltage, ranking by color rendering index
nichia sts - da1 - 3316 c 10 derating characteristics nssxt02a-v1 ? no . sts - da 7 - 6628 b 0 30 60 90 120 150 0 20 40 60 80 100 120 derating2 (85, 130) (100, 74.0) ???? ( `? ) - S solder temperature(cathode side) vs allowable forward current S allowable forward current(ma) ???? ( `? ) solder temperature(cathode side)( c) 10 100 1000 1 10 100 duty 130 150 S allowable forward current(ma) ?`?` duty ratio(%) ?`?` - S duty ratio vs allowable forward current t a =25 c
nichia sts - da1 - 3316 c 11 optical characteristics NSSWT02A-V1 ? no . sts - da 7 - 6619 b 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 700 750 spectrum ? relative illuminance(a.u.) 90 80 70 60 50 40 30 20 10 0 - 10 - 20 - 30 - 40 - 50 - 60 - 70 - 80 - 90 directivity1 k??? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 1 0.5 0 0.5 1 a 65ma i f = t =25 c 65ma i fp = t a =25 c * ??? all characteristics shown are for reference only and are not guaranteed. x - x y - y y y x x
nichia sts - da1 - 3316 c 12 forward current characteristics / temperature characteristics NSSWT02A-V1 ? no . sts - da 7 - 6620 b 2.0 2.5 3.0 3.5 4.0 -60 -40 -20 0 20 40 60 80 100 120 tavf 0.6 0.8 1.0 1.2 1.4 -60 -40 -20 0 20 40 60 80 100 120 taiv 10 100 1000 2.0 2.5 3.0 3.5 4.0 vfif 65 150 relative luminous flux(a.u.) ?? - ambient temperature vs relative luminous flux forward current(ma) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 50 100 150 200 ifiv relative luminous flux(a.u.) - forward current vs relative luminous flux forward current(ma) ?R - forward voltage vs forward current ?? - ?R ambient temperature vs forward voltage ?R forward voltage(v) ?R forward voltage(v) ?? ambient temperature( c) ?? ambient temperature( c) t a =25 c * ??? all characteristics shown are for reference only and are not guaranteed. t a =25 c i fp = 65ma i fp = 65ma
nichia sts - da1 - 3316 c 13 forward current characteristics / temperature characteristics NSSWT02A-V1 ? no . sts - da 7 - 6629 a 0.34 0.35 0.36 0.37 0.38 0.39 0.33 0.34 0.35 0.36 0.37 0.38 taxy 0 c 25 c 100 c - 40 c x 0.34 0.35 0.36 0.37 0.38 0.39 0.33 0.34 0.35 0.36 0.37 0.38 ifxy 10ma 65ma 150ma x y y 65ma i fp = ?? - ? ambient temperature vs chromaticity coordinate - ? forward current vs chromaticity coordinate t a =25 c * ??? all characteristics shown are for reference only and are not guaranteed.
nichia sts - da1 - 3316 c 14 reliability (1) tests and results test reference standard test conditions test duration failure criteri a # units failed/tested resistance to soldering heat (reflow soldering) jeita ed - 4701 300 301 t sld =260c, 10sec, 2reflows, precondition: 30c, 70%rh, 168hr #1 0/22 solderability (reflow soldering) jeita ed - 4701 303 303a t sld =2455c, 5sec, lead - free so lder(sn - 3.0ag - 0.5cu) #2 0/22 temperature cycle jeita ed - 4701 100 105 - 40 c(30min)~25 c( 5 min)~ 100 c(30min)~25 c( 5 min) 100cycles #1 0/50 moisture resistance (cyclic) jeita ed - 4701 200 203 25c~65c~ - 10c, 90%rh, 24hr per cycle 10cycles #1 0/22 high temp erature storage jeita ed - 4701 200 201 t a =100c 1000hours #1 0/22 temperature humidity storage jeita ed - 4701 100 103 t a =60c, rh=9 0 % 1000hours #1 0/22 low temperature storage jeita ed - 4701 200 202 t a = - 40c 1000hours #1 0/22 room temperature operating lif e condition 1 t a =25c, i f =65ma test board: see notes below 1000hours #1 0/22 room temperature operating life condition 2 t a =25c, i f =1 30 ma test board: see notes below 500hours #1 0/22 high temperature operating life t a =100c, i f = 5 0 ma test board: see n otes below 1000hours #1 0/22 temperature humidity operating life 60c, rh=9 0 %, i f = 65 ma test board: see notes below 500hours #1 0/22 low temperature operating life t a = - 40c, i f =65ma test board: see notes below 1000hours #1 0/22 vibration jeita ed - 4701 400 403 200m/s 2 , 100~2000~100hz, 4cycles, 4min, each x, y, z 48minutes #1 0/22 soldering joint shear strength jeita ed - 4702b 002 3 5n, 101sec #1 0/22 notes: measurements are performed after allowing the leds to return to room temperature. (2) f ailure criteria criteria # items conditions failure criteria #1 forward voltage(v f ) i f =65ma >u.s.l.1. 1 luminous flux( v ) i f =65ma u.s.l.2.0 #2 solderability - less than 95% solder coverage u.s.l. : upper specification limit l.s.l. : lower specification limit
nichia sts - da1 - 3316 c 15 cautions (1) storage conditions temperature humidit y time storage before opening aluminum bag 30c 90%rh within 1 year from delivery date after opening aluminum bag 30c 70%rh 168hours product complies with jedec msl 3 or equivalent. see ipc/jedec std - 020 for moisture - sensitivity details. abs orbed moisture in led packages can vaporize and expand during soldering, which can cause interface delamination and result in optical performance degradation. products are packed in moisture - proof aluminum bags to minimize moisture absorption during transportation and storage. included silica gel desiccants change from blue to red if moisture had penetrated bags. after opening the moisture - proof aluminum bag, the products should go through the soldering process within the range of the conditions stated above. unused remaining leds should be stored with silica gel desiccants in a hermetically sealed contain er, preferably the original moisture - proof bags for storage. although the leads or electrode pads (anode and cathode) of the product are plated with gold, prolonged exposure to a corrosive environment might cause the gold plated the leads or electro de pads to tarnish, and thus leading to difficulties in soldering. if unused leds remain, they must be stored in a hermetically sealed container. nichia recommends using the original moisture - proof bag for storage. do not use sulfur - containing m aterials in commercial products. some materials, such as seals and adhesives, may contain sulfur. the extremely corroded or contaminated plating of leds might cause an open circuit. silicone rubber is recommended as a material for seals. bear in mind , the use of silicones may lead to silicone contamination of electrical contacts inside the products, caused by low molecular weight volatile siloxane. to prevent water condensation, please avoid large temperature and humidity fluctuations for the storage conditions. do not store the leds in a dusty environment. do not expose the leds to direct sunlight and/or an environment where the temperature is higher than normal room temperature. (2) directions for use when designing a circuit, the current through each led must not exceed the absolute maximum rating. operating at a constant current per led is recommended. in case of operating at a constant voltage, circuit b is recommended. if the leds are operated with constant voltage using circuit a, the current through the leds may vary due to the variation in forward voltage characteristics of the leds. this product should be oper ated using forward current. ensure that the product is not subjected to either forward or reverse voltage while it is not in use. in particular, subjecting it to continuous reverse voltage may cause migration, which may cause damage to the led die. when used in displays that are not used for a long time, the main power supply should be switched off for safety. it is recommended to operate the leds at a current greater than 10% of the sorting current to stabilize the led characteris tics. care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the leds with matrix drive. ensure that excessive voltages such as lightning surges are not applied to the leds. for outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage. (a) . . . (b) . . .
nichia sts - da1 - 3316 c 16 (3) handling precautions do not handle th e leds with bare hands as it will contaminate the led surface and may affect the optical characteristics: it might cause the led to be deformed and/or the bump to break, which will cause the led not to illuminate. when handling the product with twe ezers, be careful not to apply excessive force to the resin. otherwise, the resin can be cut, chipped, delaminate or deformed, causing bump - bond breaks and catastrophic failures. dropping the product may cause damage. do not stack assembled pcbs t ogether. failure to comply can cause the resin portion of the product to be cut, chipped, delaminated and/or deformed. it may cause bump to break, leading to catastrophic failures. (4) design consideration pcb warpage after mounting the products on to a pcb can cause the package to break. the led should be placed in a way to minimize the stress on the leds due to pcb bow and twist. the position and orientation of the leds affect how much mechanical stress is exerted on the leds placed near the score lin es. the led should be placed in a way to minimize the stress on the leds due to board flexing. board separation must be perf ormed using special jigs, not using hands. volatile organic compounds that have been released from materials present around the leds (e.g. housing, packing, adhesive, secondary lens, lens cover, etc.) may penetrate the led lens and/or encapsulating resin. if the leds are being used in a hermetically sealed environment, these volatile compounds can discolor after being exposed to heat and/or photon energy and it may greatly reduce the led light output and/or cause a color shift. in this ca se, ventilating the environment may improve the reduction in light output and/or color shift. perform a light - up test of the chosen application for optical evaluation to ensure that there are no issues, especially if the leds are planned to be used in a hermetically sealed environment. (5) electrostatic discharge (esd) the products are sensitive to static electricity or surge voltage. esd can damage a die and its reliability. when handling the products, the following measures against electro static discharge are strongly recommended: eliminating the charge grounded wrist strap, esd footwear, clothes, and floors grounded workstation equipment and tools esd table/shelf mat made of conductive materials ensure that tools (e.g. soldering irons), jigs and machines that are being used are properly grounded and that proper grounding techniques are used in work areas. for devices/equipment that mount the leds, protection against surge voltages should also be used. if tools or equipment contain insulating materials such as glass or plastic, the following measures against electrostatic discharge are strongly recommended: dissipating static charge with conductive materials preventing charge generation wit h moisture neutralizing the charge with ionizers the customer is advised to check if the leds are damaged by esd when performing the characteristics inspection of the leds in the application. damage can be detected with a forward voltage me asurement or a light - up test at low current (1ma). esd damaged leds may have current flow at a low voltage or no longer illuminate at a low current. failure criteria: v f <2.0v at i f =0.5ma
nichia sts - da1 - 3316 c 17 (6) thermal management proper thermal management is an important when designing products with leds. led die temperature is affected by pcb thermal resistance and led spacing on the board. please design products in a way that the led die temperature does not exceed the maximum junction temperature (t j ). drive current should be determined for the surrounding ambient temperature (t a ) to dissipate the heat from the product. the following equations can be used to calculate the junction temperature of the products. 1) t j =t a +r ja ? w 2) t j =t s +r js ? w *t j =led junction temperature: c t a =ambient temperature: c t s =soldering temperature (cathode side): c r ja =thermal resistance from junction to ambient: c/w r js =thermal resistance from junction to t s measuring point: c/w w=input power(i f v f ): w (7) cleaning when washing after soldering is needed, following conditions are requested. a) washing solvent: pure water b) temperature, time: 50 c or less 30seconds max. or 30 c or less 3 minutes max. c) u ltrasonic washing: 300w or less (8) eye safety in 2006, the international electrical commission (iec) published iec 62471:2006 photobiological safety of lamps and lamp systems, which added leds in its scope. on the other hand, the iec 60825 - 1:20 07 laser safety standard removed leds from its scope. however, please be advised that some countries and regions have adopted standards based on the iec laser safety standard iec 60825 - 1:20112001, which still includes leds in its scope. most of nichia's leds can be classified as belonging into either the exempt group or risk group 1. high - power leds, that emit light containing blue wavelengths, may be classified as risk group 2. please proceed with caution when viewing directly any leds d riven at high current, or viewing leds with optical instruments which may greatly increase the damages to your eyes. viewing a flashing light may cause eye discomfort. when incorporating the led into your product, please be careful to avoid adve rse effects on the human body caused by light stimulation. (9) others the leds described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and hou sehold appliances). consult nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control system, automobiles, traffic control equipment, life support systems and safety devices). the customer shall not reverse engineer by disassembling or analysis o f the leds without having prior written consent from nichia. when defective leds are found, the customer shall inform nichia directly before disassembling or analysis. the specifications and appearance of this product may change without notice; nichia does not guarantee the contents of this specification. both the customer and nichia will agree on the official specifications of supplied products before the volume production of a program begins. ts point
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